ASML to Develop Larger High-NA EUV Tools for Next-Generation AI Chips
New lithography technology could help chipmakers produce larger data-centre processors while improving manufacturing productivity
AMSTERDAM, Sept 8: Dutch semiconductor equipment maker ASML is working with major chip companies to develop next-generation lithography systems capable of producing larger chips designed for artificial intelligence and data centre applications.
The company plans to modify its High Numerical Aperture (High NA) extreme ultraviolet (EUV) systems to accommodate larger masks, allowing manufacturers to produce chips as large as those currently made using existing EUV technology.
ASML is collaborating with major industry players including Nvidia, Google, Intel, TSMC and Samsung as chipmakers seek more powerful processors to meet the rapidly increasing computing requirements of AI systems.
The company’s current EUV machines can process chips measuring up to about 800 square millimetres. However, the first generation of High NA equipment has faced limitations because of smaller masks.
ASML aims to overcome the restriction by developing larger masks for its High NA systems. The company plans to demonstrate a pilot production line using the new technology by 2031 and expects high volume manufacturing to begin around 2033.
According to ASML, the upgraded technology could potentially increase productivity by about 40 per cent, making it significant for future advanced-node and high-performance computing applications.
Intel is already using High NA EUV equipment for laptop chip production, while TSMC and Samsung are preparing to incorporate the technology into future manufacturing processes. SK Hynix, TSMC and Samsung have also indicated plans to use High NA EUV for advanced memory and logic production in the coming years.
The development comes as semiconductor manufacturers race to expand computing capacity for AI applications, increasing demand for increasingly powerful and energy efficient processors.
